| 发明名称 |
FAN-OUT PACKAGES AND METHODS OF FORMING SAME |
| 摘要 |
An embodiment a device package includes a semiconductor die, a molding compound extending along sidewalls of the semiconductor die, and a planarizing polymer layer over the molding compound and extending along the sidewalls of the semiconductor die. The molding compound includes first fillers, and the planarizing polymer layer includes second fillers smaller than the first fillers. The device package further includes one or more fan-out redistribution layers (RDLs) electrically connected to the semiconductor die, wherein the one or more fan-out RDLs extend past edges of the semiconductor die onto a top surface of the planarizing polymer layer. |
| 申请公布号 |
US2017033063(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201514815170 |
申请日期 |
2015.07.31 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Jing-Cheng;Chang Jeffrey;Su Chun-Hsing;Fu Tsei-Chung;Mao Yi-Chao |
| 分类号 |
H01L23/00;H01L23/31;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package comprising:
a semiconductor die; a molding compound extending along sidewalls of the semiconductor die, wherein the molding compound comprises first fillers; a planarizing polymer layer over the molding compound and extending along the sidewalls of the semiconductor die, wherein the planarizing polymer layer comprises second fillers smaller than the first fillers, an average thickness of the planarizing polymer layer being no more than about twenty percent of an average thickness of the molding compound; and one or more fan-out redistribution layers (RDLs) electrically connected to the semiconductor die, wherein the one or more fan-out RDLs extend past edges of the semiconductor die onto a top surface of the planarizing polymer layer. |
| 地址 |
Hsin-Chu TW |
