发明名称 |
Thermoplastic Resin Composition and Molded Article Comprising the Same |
摘要 |
A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes about 100 parts by weight of a base resin including about 60 wt % to about 80 wt % of a polycarbonate (PC) resin and about 20 wt % to about 40 wt % of a polyester resin including a repeat unit represented by the following Formula 1 wherein in Formula 1, Ar1 is a substituted or unsubstituted C6 to C18 arylene group and R1 is a C1 to C20 linear alkylene group or a C3 to C20 branched alkylene group; and about 1 part by weight to about 3 parts by weight of a linear (meth)acrylic resin:; |
申请公布号 |
US2017029617(A1) |
申请公布日期 |
2017.02.02 |
申请号 |
US201615222188 |
申请日期 |
2016.07.28 |
申请人 |
Samsung SDI Co., Ltd. |
发明人 |
PARK Jeong Eun;JEONG Hee Yun;KWON Kee Hae;HONG Chang Min |
分类号 |
C08L69/00;C08L67/02 |
主分类号 |
C08L69/00 |
代理机构 |
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代理人 |
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主权项 |
1. A thermoplastic resin composition comprising:
about 100 parts by weight of a base resin comprising about 60 wt % to about 80 wt % of a polycarbonate (PC) resin and about 20 wt % to about 40 wt % of a polyester resin comprising a repeat unit represented by the following Formula 1: wherein Ar1 is a substituted or unsubstituted C6 to C18 arylene group and R1 is a C1 to C20 linear alkylene group or a C3 to C20 branched alkylene group; and about 1 part by weight to about 3 parts by weight of a linear (meth)acrylic resin. |
地址 |
Yongin-si KR |