发明名称 Thermoplastic Resin Composition and Molded Article Comprising the Same
摘要 A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes about 100 parts by weight of a base resin including about 60 wt % to about 80 wt % of a polycarbonate (PC) resin and about 20 wt % to about 40 wt % of a polyester resin including a repeat unit represented by the following Formula 1 wherein in Formula 1, Ar1 is a substituted or unsubstituted C6 to C18 arylene group and R1 is a C1 to C20 linear alkylene group or a C3 to C20 branched alkylene group; and about 1 part by weight to about 3 parts by weight of a linear (meth)acrylic resin:;
申请公布号 US2017029617(A1) 申请公布日期 2017.02.02
申请号 US201615222188 申请日期 2016.07.28
申请人 Samsung SDI Co., Ltd. 发明人 PARK Jeong Eun;JEONG Hee Yun;KWON Kee Hae;HONG Chang Min
分类号 C08L69/00;C08L67/02 主分类号 C08L69/00
代理机构 代理人
主权项 1. A thermoplastic resin composition comprising: about 100 parts by weight of a base resin comprising about 60 wt % to about 80 wt % of a polycarbonate (PC) resin and about 20 wt % to about 40 wt % of a polyester resin comprising a repeat unit represented by the following Formula 1: wherein Ar1 is a substituted or unsubstituted C6 to C18 arylene group and R1 is a C1 to C20 linear alkylene group or a C3 to C20 branched alkylene group; and about 1 part by weight to about 3 parts by weight of a linear (meth)acrylic resin.
地址 Yongin-si KR