发明名称 METHOD AND SYSTEM FOR GENERATING IMAGES AND OBJECTS VIA DISPLAY-AS-PRINT
摘要 A method for depositing onto a surface building material that is in powder, slurry or liquid form. The building material is comprised at least in part of a photosensitive material. The method involves exposing the building material to a first specific wavelength of radiation to process the building material to form a first object layer, depositing onto the first object layer additional building material in powder, slurry or liquid form, exposing the additional building material that is deposited onto the first object layer to a second specific wavelength of radiation to process the additional building material to form a second object layer, and repeating the deposition and exposure steps to create as many layers as are necessary to complete the object. A computer-implemented system for generating a two-dimensional image comprising a pixel output device, a camera, a sending program and a receiving program.
申请公布号 US2017028622(A1) 申请公布日期 2017.02.02
申请号 US201615201210 申请日期 2016.07.01
申请人 Zadiance LLC 发明人 Westlind Samuel;O'Loughlin Daniel;Stewart Frank M.
分类号 B29C67/00;B33Y50/02;G03F7/00;B33Y10/00 主分类号 B29C67/00
代理机构 代理人
主权项 1. A method for creating a two-dimensional image comprising the steps of: providing a substrate with a first layer of microencapsulated material, the microencapsulated material being photosensitive; providing a substrate with a second layer of microencapsulated material, the microencapsulated material being electrically conductive; exposing the first layer of microencapsulated material to a first specific wavelength of radiation in a specific image pattern, thereby releasing the photosensitive material from microencapsulation; exposing the released photosensitive material to a second specific wavelength to process the photosensitive material and bond it to a first surface of the substrate; exposing the second layer of microencapsulated material to a third specific wavelength of radiation in a specific image pattern, thereby releasing the electrically conductive material from microencapsulation; and exposing the released electrically conductive material to a fourth specific wavelength of radiation to process the electrically conductive material and bond it to a second surface of the substrate.
地址 Bozeman MT US
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