发明名称 PROCESS OF TREATING A WORKPIECE USING A LIQUID JET GUIDED LASER BEAM
摘要 The invention concerns a process for treating a workpiece, preferably for shaping a workpiece by ablating material, by a liquid jet guided laser beam. The process comprises the following steps: Production of a liquid jet by a nozzle; impinging the liquid jet on a reference surface allocated to the workpiece, whereby an intersection of the liquid jet with the reference surface defines a liquid jet-footprint; effecting a displacement between the liquid jet and the reference surface, whereby the liquid jet- footprint evolves to a trace along a trajectory associated with the trace during the time frame, wherein the trace covers a trace-area; irradiating the workpiece at least during part of the time frame with a laser beam coupled into the liquid jet, preferably for ablating material such that the trace has at least one overlap-area, wherein each of the at least one overlap-areas is defined by an associated common area of an associated second length-section of the trace and an associated first length-section of the trace and wherein the workpiece is irradiated by the laser beam along at least one of the length-sections. It concerns further a computerized numerical control (CNC) program for controlling a liquid jet guided laser machining device and a computer readable medium containing such a CNC program. Further, it contains a computer program for generating the above mentioned CNC program. Finally the invention concerns a liquid jet guided laser machining device to perform the above mentioned process.
申请公布号 WO2017017142(A1) 申请公布日期 2017.02.02
申请号 WO2016EP67911 申请日期 2016.07.27
申请人 SYNOVA SA 发明人 RICHERZHAGEN, Bernold;DELAHAYE, Stephane;BRUCKERT, Florent;RONAN, Martin;CARRON, Benjamin;RICHMANN, Annika;KUZMINYKH, Yury
分类号 B23K26/08;B23K26/146;B26F1/31;B26F3/00 主分类号 B23K26/08
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