Ensamblaje de dos sustratos pegados por un polímero flexible, procedimientos de montaje y de desmontaje por migración de este ensamblaje pegado

摘要

An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young's tensile modulus value at 25° C. of between 0.1 and 500 MPa, and includes at least one migrating agent suitable for migrating up to at least one of the interfaces of the joint (14) in order to generate interfacial detachment. A composition enabling the bonding of the assembly, a method for mounting the assembly by bonding, and a method for dismantling the bonded assembly by way of migration and creation of an interfacial detachment by localized heating are also described.