| 摘要 |
[Problem] To provide a suction plating apparatus according to the present invention that includes improvements in clips for holding a workpiece and liquid circulation of a plating solution. [Solution] This suction plating apparatus 1 is provided with: a pre-processing stage A comprising at least a hot-water washing unit, a water washing unit and an acid degreasing unit; a plating stage B; and a post-processing stage C comprising at least a water washing unit and a drying unit. A plating unit 2, which operates in the plating stage B, comprises at least: a plating tank 20 containing a plating solution for plating a workpiece 40; a plurality of clips 10 for holding the upper end of the workpiece 40 and allowing current to flow through the workpiece 40; a conveyor 30 for moving the plurality of clips 10 along the plating tank 20; and a circulation unit D for circulating the plating solution 21 in the plating tank 20. The workpiece 40 is disposed parallel to the direction of movement of the clips 10 and the clips 10 hold the upper end of the workpiece 40. A tip part of each clip 10 holding the workpiece 40 is treated so that a predetermined region of a portion thereof not in contact with the workpiece 40 is insulated. The predetermined insulated regions of the clips 10 are immersed in the plating solution 21 in the plating tank 20 with the workpiece 40. |
