| 发明名称 |
IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR |
| 摘要 |
Disclosed is an improvement of strength of adhesion between a photoconductive layer and a substrate. The image sensor includes a first electrode and a protruding pattern formed around the first electrode on the substrate, a protective film having an protruded surface formed on the protruding pattern, the photoconductive layer formed on the protective film, and a second electrode formed on the photoconductive layer. |
| 申请公布号 |
US2017033149(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201515302251 |
申请日期 |
2015.04.07 |
| 申请人 |
Rayence Co., Ltd. ;VATECH EWOO Holdings Co., Ltd. |
发明人 |
KIM Tae Woo;LEE Dong Jin |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensor comprising:
a first electrode formed on a substrate; a protruding pattern formed around the first electrode on the substrate; a protective film formed on the protruding pattern to have a protruded surface caused by the protruding pattern and to have a pad hole exposing the first electrode; a photoconductive layer formed on the protective film and contacted to the first electrode through the pad hole; and a second electrode formed on the photoconductive layer. |
| 地址 |
Gyeonggi-do KR |
