| 发明名称 |
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more. |
| 申请公布号 |
US2017032884(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201615146470 |
申请日期 |
2016.05.04 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI Woon Chul;JUNG Jung Hyuk;LEE Woo Jin;RYU Han Wool |
| 分类号 |
H01F27/28;H01F41/02;H01F27/245;H01F41/04 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A coil electronic component comprising:
a magnetic body, wherein the magnetic body includes:
a substrate, anda coil part including patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. |
| 地址 |
Suwon-si KR |
