APPARATUS AND METHOD FOR SOLDERING JOINING PARTNERS, SAID APPARATUS COMPRISING A VACUUM CHAMBER AND PLATE ELEMENTS

摘要

The invention describes an apparatus and a method for soldering mating parts, in particular electrical components to circuit boards or other carrier elements. The mating parts may be received and pressed together between two plate elements. One of the plate elements, which is heatable, may be flexible and may be elastically biased in the direction of the other plate element, by means of a plurality of elastically biased elements. Alternatively or additionally, heating may be provided for both plate elements.

主权项

1. An apparatus for soldering mating parts, in particular electrical components to circuit boards or other carrier elements, the apparatus comprising:
a vacuum chamber, which is connective to a vacuum unit; a first plate element in the vacuum chamber; a second plate element in the vacuum chamber, the second plate element being moveable between an open position and a closed position, wherein the second plate element in the closed position is arranged opposite the first plate element, in order to be able to press together mating parts, which are received between the plate elements, wherein one of the plate elements is flexible and the other one is rigid; a plurality of elastically-biased elements, which are capable of contacting the flexible plate element, and to elastically bias the flexible plate element towards the other plate element, and at least one first heating unit, which is capable of heating the flexible plate element.