| 摘要 |
PROBLEM TO BE SOLVED: To uniformly polish a material to be polished, by restraining polishing slurry from permeating through a polishing pad.SOLUTION: A polishing pad of the present invention includes an upper layer sheet having a polishing surface on a top surface, and a lower layer sheet that is superposed on the undersurface side of the upper layer sheet. A peripheral edge of the upper layer sheet is protruded to the outside with respect to a peripheral edge of the lower layer sheet. A material of the lower layer sheet is exposed on the whole side surface of the lower layer sheet. |
