| 摘要 |
A packaging device includes a conveyance mechanism, a heater, a guide portion, and a processor. The conveyance mechanism is configured to convey a base along a conveyance path. The heater is configured to heat the film and bond the film to the base that is conveyed by the conveyor. The guide portion is configured to guide the film toward the heater and move along a movement path that extends in a direction intersecting the conveyance path. The processor is configured to control the conveyance mechanism, the heater, and the guide portion. |
