发明名称 機能素子、センサー素子および電子機器
摘要 PROBLEM TO BE SOLVED: To provide a function element where reduction of manufacturing efficiency is suppressed, a method for manufacturing the function element, and an electronic apparatus.SOLUTION: A function element includes: a substrate 12 having a main surface 16; groove parts (a first groove part 24 and a second groove part 26) arranged on the main surface 16; and fixed element parts (a first fixed electrode finger 78 and a second fixed electrode finger 80) arranged over the groove parts on the substrate 12. Protrusions 54 and 56 formed by using at least one of the substrate and the fixed element parts on a position superposed to the fixed element parts in planar view are formed in the groove parts, each of the protrusions 54 and 56 has a joining surface (end face 82), wires (a first wire 30 and a second wire 36) are arranged on the joining surface side, and the substrate 12 is connected to the fixed element parts through the wires.
申请公布号 JP6070787(B2) 申请公布日期 2017.02.01
申请号 JP20150154815 申请日期 2015.08.05
申请人 セイコーエプソン株式会社 发明人 與田 光宏;河野 秀逸;高木 成和;山▲崎▼ 成二
分类号 G01P15/08;G01P15/125;H01L29/84 主分类号 G01P15/08
代理机构 代理人
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