发明名称 FLUX AND SOLDER PASTE
摘要 Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30 % through 70 % and content of the long-chain dibasic acid mixture is 20 % through 60 %.
申请公布号 EP3124167(A1) 申请公布日期 2017.02.01
申请号 EP20150770209 申请日期 2015.02.27
申请人 Senju Metal Industry Co., Ltd 发明人 UEHATA Masashi;YAMAGAWA Yasuyuki;KITAZAWA Kazuya;TAKAGI Yoshinori
分类号 B23K35/363;B23K35/26;C22C13/00 主分类号 B23K35/363
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