发明名称 |
FLUX AND SOLDER PASTE |
摘要 |
Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30 % through 70 % and content of the long-chain dibasic acid mixture is 20 % through 60 %. |
申请公布号 |
EP3124167(A1) |
申请公布日期 |
2017.02.01 |
申请号 |
EP20150770209 |
申请日期 |
2015.02.27 |
申请人 |
Senju Metal Industry Co., Ltd |
发明人 |
UEHATA Masashi;YAMAGAWA Yasuyuki;KITAZAWA Kazuya;TAKAGI Yoshinori |
分类号 |
B23K35/363;B23K35/26;C22C13/00 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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