| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which enables an insulating layer to be formed, the insulating layer having a surface showing a small arithmetic mean roughness and a small root-mean-square roughness in a wet roughening step, while maintaining the glass transition temperature and the coefficient of thermal expansion, and which enables a plated conductor layer to be formed on the insulating layer surface, the plated conductor layer having satisfactory peel strength.SOLUTION: The resin composition contains an epoxy resin, a trifunctional alkoxysilane-modified resin, and an inorganic filler. |
