发明名称 電子機器
摘要 A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.
申请公布号 JP6069237(B2) 申请公布日期 2017.02.01
申请号 JP20140034940 申请日期 2014.02.26
申请人 京セラ株式会社 发明人 荒尾 克己;岩井 章人
分类号 H04M1/02;H05K5/02 主分类号 H04M1/02
代理机构 代理人
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