| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate transfer method and a substrate transfer device, capable of bonding chips to all islands of one substrate in one time of carrying-out of the one substrate from a transfer path.SOLUTION: In a substrate transfer method in which a plurality of strip-like substrates on which a plurality of islands are formed at predetermined pitch along a longitudinal direction are sequentially transferred along the longitudinal direction, an adhesive agent is applied to the islands on the strip-like substrates at a dispensing position on an upstream side, and then chips are bonded to the islands on the strip-like substrates at a bonding position on a downstream side, a dispensing process is performed by sending back the islands having passed through the dispensing position to the dispensing position and a bonding process is performed by sending back the islands having passed through the bonding position to the bonding position. |
