| 摘要 |
A packaged electronic device is disclosed, comprising: a package, a die (204) and a first bondwire (212). The package comprises a leadframe. The leadframe comprises a first conducting leadframe element (208) and a second conducting leadframe element (206) that are separate from each other. The die (204) comprises a first bondpad. The first bondwire (212) electrically connects the first bondpad to the first conducting leadframe element (208). The die (204) mechanically couples the first and second leadframe elements (208, 206) together. |
