DIE MOUNTING SYSTEM AND DIE MOUNTING METHOD

摘要

In a die mounting system in which die supply device 12 is set on component mounter 11 and dies 22 supplied from die supply device 12 are mounted on circuit board 17 by mounting head 15 of component mounter 11, the next die transfer position is determined such that the longer of time Ta required for die transfer preparation operation (die 22 imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device 12 and time Tb required for die mounting operation (movement and vertical motion at the mounting position of mounting head 15) of component mounter 11 is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.