| 摘要 |
A solution relating to electronic devices of flip-chip type is proposed. Particularly, an electronic device (200,300;400;700;800) of flip-chip type comprises at least one chip carrier (110;805) having a carrier surface (135;835), the carrier comprising one or more contact elements (140s,140p;740s,740p;840s,840p) of electrically conductive material on the carrier surface, at least one integrated circuit chip (105;705) having a chip surface (120;720), the chip comprising one or more terminals (125s,125p;725s,725p) of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material (150;750) soldering each terminal to the corresponding contact element, and restrain means (210s,210p,310;410s1,410sd,410p;790s,790p;890s,890p) around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements, wherein the carrier comprises one or more heat dissipation elements (205s,205p;785s,785p;885s,885p) of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask. |
