アクリレートポリウレタンケミカルメカニカル研磨層

摘要

A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G', of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 mum/min.