| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical device 1 in which thickness and weight are reduced and an ultraviolet cut type translucent substrate is used, and to provided a manufacturing method of the optical device 1, which reduces components to simplify the manufacturing process and thereby manufactures the optical device 1 at low costs.SOLUTION: An optical device 1 comprises: a lead frame 2; an optical chip 3 which is joined to one surface of the lead frame 2; a translucent substrate 4 installed on the other surface side of the lead frame 2; and a resin material 5 which seals an outer peripheral part between the optical chip 3 and the translucent substrate 4. The optical chip 3 comprises: an optical active region 6 located on its lead frame 2 side surface; and electrode pads 7 located at the outer periphery side relative to the optical active region 6. The electrode pads 7 are joined to the lead frame 2. |
