发明名称 LAYOUT CONSTRUCTION FOR ADDRESSING ELECTROMIGRATION
摘要 A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect on an interconnect level extending in a length direction to connect the PMOS drains together. A second interconnect on the interconnect level extends in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together. A third interconnect on the interconnect level extends perpendicular to the length direction and is offset from the set of interconnects to connect the first interconnect and the second interconnect together.
申请公布号 EP3036767(B1) 申请公布日期 2017.02.01
申请号 EP20140758471 申请日期 2014.08.21
申请人 Qualcomm Incorporated 发明人 RASOULI, Seid Hadi;BRUNOLLI, Michael Joseph;HAU-RIEGE, Christine Sung-An;MALABRY, Mickael;HARISH, Sucheta Kumar;BALASUBRAMANIAN, Prathiba;MEDISETTI, Kamesh;BOMSHTEIN, Nikolay;DATTA, Animesh;KWON, Ohsang
分类号 H01L27/02;H01L21/8238;H01L23/482;H01L23/522;H01L23/528;H01L27/092;H03K17/16;H03K17/687 主分类号 H01L27/02
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