发明名称 |
TSV-CONNECTED BACKSIDE DECOUPLING |
摘要 |
An apparatus including a die including a plurality of through silicon vias (TSV's) extending from a device side to a backside of the die; and a decoupling capacitor coupled to the TSV's. A method including providing a die including a plurality of through silicon vias (TSV's) extending from a device side to a backside of the die; coupling a decoupling capacitor to the backside of the die. An apparatus including a computing device including a package including a microprocessor including a device side and a backside with through silicon vias (TSV's) extending from the device side to the backside, and a decoupling capacitor coupled to the backside of the die; and a printed circuit board, wherein the package is coupled to the printed circuit board. |
申请公布号 |
EP3123504(A1) |
申请公布日期 |
2017.02.01 |
申请号 |
EP20140886705 |
申请日期 |
2014.03.28 |
申请人 |
Intel Corporation |
发明人 |
LAMBERT, William J.;SANKMAN, Robert L.;OSBORN, Tyler N.;GEALER, Charles A. |
分类号 |
H01L23/48;H01L29/92 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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