发明名称 Power electronics assembly
摘要 The assembly comprises an insulated metal substrate (IMS) 103, a composite material substrate 101, and a bolt 106 comprising a bolt head and a bolt shaft for mechanically coupling the composite material substrate to the insulated metal substrate. The assembly also comprises an electrically conductive sleeve 115 configured to held between a first electrical contact 160 carried by the insulated metal substrate and a second electrical contact 162 carried by the composite material substrate and the bolt is configured to clamp the composite material substrate to the insulated metal substrate to force the electrically conductive sleeve against the first and second electrical contacts. The insulating sleeve has a wall or cup portion 113 surrounding the bolt head to inhibit electrical breakdown between the bolt head and the composite substrate. The bolt may be electrically connected to the IMS substrate. A portion of the IMS substrate 121, situated below a chamfer portion of the conductive sleeve, is exposed between the bolt hole in the IMS substrate and the IMS contact for the electrically conductive sleeve. The IMS substrate may be coupled to a heatsink 102 by alignment pins
申请公布号 GB2540783(A) 申请公布日期 2017.02.01
申请号 GB20150013204 申请日期 2015.07.27
申请人 Sevcon Limited 发明人 Peter Barrass;Matt Jackson
分类号 H05K1/14;H02M7/00 主分类号 H05K1/14
代理机构 代理人
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