发明名称 セラミック積層電子部品
摘要 PROBLEM TO BE SOLVED: To provide a ceramic multilayer electronic component having excellent high temperature reliability of an insulation resistance, by preventing the plating solution from infiltrating a base electrode to intrude into an electronic component.SOLUTION: A ceramic multilayer electronic component 1 includes a laminate 4, a base electrode 5 containing metal and glass components, and a terminal electrode 7 consisting of a plating metal layer 6. The base electrode is constituted of a surface region and an intermediate region, the glass component of the surface region contains zirconia, and the content of zirconia in the glass component of the surface region is larger than that of the intermediate region.
申请公布号 JP6070287(B2) 申请公布日期 2017.02.01
申请号 JP20130042649 申请日期 2013.03.05
申请人 TDK株式会社 发明人 楫野 隆;畑中 潔;鈴木 孝志;神 健治;佐藤 真一;冨田 将来
分类号 H01G4/30;H01C7/10;H01F27/29;H01G4/232 主分类号 H01G4/30
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