PASSAGE MEMBER AND SEMICONDUCTOR MODULE

摘要

There are provided a flow passage member having excellent heat dissipation properties and a semiconductor module in which a semiconductor device is mounted on a metal layer disposed on the flow passage member. A flow passage member (1) includes a wall formed of ceramics, a space surrounded by the wall being a flow passage (2) through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface (3a) of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface (3b) of the wall part. The flow passage member (1) configured as described above has excellent heat dissipation properties.