发明名称 振動機構を備えたワイヤボンディング装置
摘要 A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.
申请公布号 JP6073991(B2) 申请公布日期 2017.02.01
申请号 JP20150145817 申请日期 2015.07.23
申请人 エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド 发明人 ケン・ユー・ソン;カ・シング・クワン;ユエ・ジャン;ヤン・ドン・スン;シャオ・リャン・チェン
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
代理机构 代理人
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