| 摘要 |
The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 µm to 50 µm, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive. |
