发明名称 セラミック積層電子部品
摘要 PROBLEM TO BE SOLVED: To suppress occurrence of cracking due to thermal shock, in a ceramic multilayer electronic component.SOLUTION: A ceramic multilayer electronic component has a laminate, a base electrode containing a metal and a glass component, and a terminal electrode composed of a plating metal layer. The base electrode is constituted of a surface region and an intermediate region, the glass component of the surface region contains bismuth oxide, and the content of bismuth oxide in the glass component of the surface region is larger than that of the intermediate region.
申请公布号 JP6070288(B2) 申请公布日期 2017.02.01
申请号 JP20130042650 申请日期 2013.03.05
申请人 TDK株式会社 发明人 楫野 隆;畑中 潔;鈴木 孝志;神 健治;佐藤 真一;冨田 将来
分类号 H01G4/30;H01C7/10;H01F27/29;H01G4/232 主分类号 H01G4/30
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