发明名称 SEMICONDUCTOR MODULE AND DRIVE UNIT EQUIPPED WITH SEMICONDUCTOR MODULE
摘要 Provided is a semiconductor module having an integrated insulating sheet structure, wherein detachment of the insulating sheet can be suppressed and improved reliability of the semiconductor module is achieved, by adopting a structure in which at least one location of the insulating sheet is sunken inside a mold, and a sealing resin body and the insulating sheet of the semiconductor module form a protrusion.
申请公布号 EP3125287(A1) 申请公布日期 2017.02.01
申请号 EP20140887349 申请日期 2014.03.28
申请人 Mitsubishi Electric Corporation 发明人 FUSHIE, Shunsuke;KAWANO, Yu;ASAO, Yoshihito;MORI, Akihiko
分类号 H01L23/29;H01L23/36 主分类号 H01L23/29
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