发明名称 |
SEMICONDUCTOR MODULE AND DRIVE UNIT EQUIPPED WITH SEMICONDUCTOR MODULE |
摘要 |
Provided is a semiconductor module having an integrated insulating sheet structure, wherein detachment of the insulating sheet can be suppressed and improved reliability of the semiconductor module is achieved, by adopting a structure in which at least one location of the insulating sheet is sunken inside a mold, and a sealing resin body and the insulating sheet of the semiconductor module form a protrusion. |
申请公布号 |
EP3125287(A1) |
申请公布日期 |
2017.02.01 |
申请号 |
EP20140887349 |
申请日期 |
2014.03.28 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
FUSHIE, Shunsuke;KAWANO, Yu;ASAO, Yoshihito;MORI, Akihiko |
分类号 |
H01L23/29;H01L23/36 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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