| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base which is obtained using a metal base containing an element with high reactivity with oxygen at an ordinary temperature and nonetheless is excellent in solder adhesiveness and weather resistance.SOLUTION: The metal base with plating is provided in which: a Co-Ni alloy plating layer and a Co-Mo alloy plating layer are formed or a Co-Ni-Mo alloy plating layer is formed on a part or all of a surface of a metal base; total coating weight of Co, Ni and Mo in the plating layer is 500 μg/dm, excluding a range of 13500 μg/dmor more; total coating weight of Ni and Mo to the total coating weight of Co, Ni and Mo, also called "Ni+Mo percentage (%)", is 10% to 50% by mass ratio; and the metal base is formed from titanium copper, phosphor bronze, Corson alloy, tombac, brass or nickel silver. The metal base with plating is used for an application in which the metal base with plating is connected to an electronic component by soldering.SELECTED DRAWING: None |
