| 摘要 |
A direct diode laser processing device is equipped with: a laser resonator (11) that oscillates multi-wavelength laser light; a transmission fiber (12) that transmits the multi-wavelength laser light oscillated by the laser resonator (11); and a laser processing machine (13) that condenses the multi-wavelength laser light transmitted by the transmission fiber (12), thereby processing a material to be processed. On the basis of the thickness and the absorption rate of the material to be processed (W), the wavelength of the multi-wavelength laser light is controlled so as to be less than 1000 nm, the beam parameter product of the multi-wavelength laser light is controlled so as to be 4-25 mm∙mrad, and the cutting speed of the material to be processed is controlled so as to be 0.1-60 m/min, thereby cutting the material to be processed (W) rapidly and with good quality. |
