发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME |
摘要 |
A semiconductor package structure is provided. The semiconductor package structure includes a first electronic component on a substrate. The semiconductor package structure also includes a second electronic component stacked on the first electronic component. The active surface of the first electronic component faces the active surface of the second electronic component. The semiconductor package structure further includes a molding compound on the first electronic component and surrounding the second electronic component. In addition, the semiconductor package structure includes a third electronic component stacked on the second electronic component and the molding compound. |
申请公布号 |
EP3125292(A1) |
申请公布日期 |
2017.02.01 |
申请号 |
EP20160175908 |
申请日期 |
2016.06.23 |
申请人 |
MediaTek Inc. |
发明人 |
LIN, Tzu-Hung;HSIAO, Ching-Wen;PENG, I-Hsuan |
分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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