| 摘要 |
After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal. |
| 主权项 |
1. A method for manufacturing an electro-optical device, comprising:
preparing a first wafer including, on a first surface side, a first mirror, a first terminal, a second mirror, and a second terminal, the first terminal being provided at a position next to the first mirror in a plan view, the first terminal being electrically connected to a first drive element driving the first mirror, the second mirror being located on the side opposite to the first mirror with respect to the first terminal, the second terminal being provided between the first terminal and the second mirror, the second terminal being electrically connected to a second drive element driving the second mirror; forming a second wafer including a second surface provided with a first recess having a light-transmitting bottom portion, a second recess having a light-transmitting bottom portion, and a groove between the first recess and the second recess; bonding the first surface of the first wafer and the second surface of the second wafer together in a manner such that the first recess overlaps the first mirror in the plan view, that the second recess overlaps the second mirror in the plan view, and that the groove overlaps in the plan view the first terminal, the second terminal, and an area interposed between the first terminal and the second terminal; dicing the second wafer along the groove by advancing a first dicing blade from a third surface of the second wafer on the side opposite to the second surface, wherein the thickness of the first dicing blade is greater than the width of the groove; and dicing the first wafer between the first terminal and the second terminal with a second dicing blade. |
