| 发明名称 | Alkaline pickling process | ||
| 摘要 | A process for edge isolation or texture smoothing of a substrate, in which a process medium which allows control treatment of limited regions of the substrate is used. The process is therefore particularly suitable for one-sided treatment of substrates. The viscosity of the process medium plays a central role here. Furthermore, an apparatus designed for the process is presented. | ||
| 申请公布号 | US9558952(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201314420246 | 申请日期 | 2013.08.12 |
| 申请人 | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V. | 发明人 | Lachowicz Agata;Schum Berthold;Blanke Heinrich |
| 分类号 | H01L21/302;H01L21/461;H01L21/306;H01L31/0236;H01L31/18;C09K13/02;H01L21/02 | 主分类号 | H01L21/302 |
| 代理机构 | Hudak, Shunk & Farine Co. LPA | 代理人 | Hudak, Shunk & Farine Co. LPA |
| 主权项 | 1. A method for etching a semiconductor substrate comprising the step of: contacting the substrate with a process medium which is provided in a process tank, wherein the substrate is transported such that it is moved in a plane which is oriented substantially in parallel direction to the surface of the process medium, and wherein the process medium comprises at least one alkaline and at least one viscosity-increasing component and has a pH value of higher than 12 and a viscosity of at least 1.5 mPas, and in that the substrate is contacted with the process medium only on one side, wherein “on one side” means that in the case of a flat substrate, such as a wafer, one of both main sides, thus the front side or the back side, is not contacted with the process medium. | ||
| 地址 | Munich DE | ||