| 发明名称 | Combiner including land pattern formed on printed board | ||
| 摘要 | The combiner includes a printed board, first and second conductor plates, and first and second conductor parts. The printed board includes a hole passing from a first surface to a second surface opposite to the first surface. The first conductor plate is made of a copper plate and mounted on the first surface of the printed board to close the hole. The second conductor plate is made of a copper plate and mounted on the second surface of the printed board to close the hole. The first conductor part is opposed to the first conductor plate with a predetermined space between the first conductor part and the first conductor plate. The second conductor part is opposed to the second conductor plate with a predetermined space between the second conductor part and the second conductor plate. | ||
| 申请公布号 | US9559402(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201314425610 | 申请日期 | 2013.08.06 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Otsuki Shunya;Itagaki Hiromu |
| 分类号 | H01P5/12;H01P5/00;H01P5/18;H05K1/18 | 主分类号 | H01P5/12 |
| 代理机构 | Knobbe, Martens, Olson & Bear LLP | 代理人 | Knobbe, Martens, Olson & Bear LLP |
| 主权项 | 1. A combiner, comprising: a printed board including a hole passing from a first surface to a second surface opposite to the first surface; a first conductor plate made of a copper plate and mounted on the first surface of the printed board to close the hole; a second conductor plate made of a copper plate and mounted on the second surface of the printed board to close the hole; a first conductor part opposed to the first conductor plate with a predetermined space between the first conductor part and the first conductor plate; and a second conductor part opposed to the second conductor plate with a predetermined space between the second conductor part and the second conductor plate, wherein a land pattern is formed on the printed board to surround the hole. | ||
| 地址 | Tokyo JP | ||