Sonic sensors and packages

摘要

Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

主权项

1. A method comprising:
providing an integrated sensor including a transmitter, a microelectromechanical (MEMS) microphone and driver electronics, the MEMS microphone and the driver electronics being integrated in a housing and disposed on a surface of the housing, wherein the integrated sensor further includes a cover disposed on the housing opposite the surface of the housing, the cover comprising a piezoelectric element of the transmitter; transmitting a signal using the piezoelectric element of the transmitter; receiving a reflected signal by the MEMS microphone through an aperture in the cover; and determining a time of flight of the signal.