发明名称 Image sensor and method of fabricating the same
摘要 Example embodiments disclose an image sensor and a fabricating method thereof. An image sensor may include a semiconductor layer with a light-receiving region and a light-blocking region, the semiconductor layer including photoelectric conversion devices, a light-blocking layer on a surface of the semiconductor layer, color filters on the semiconductor layer and the light-blocking layer, and micro lenses on the color filters. The color filters are absent from an interface region between the light-receiving region and the light-blocking region.
申请公布号 US9559140(B2) 申请公布日期 2017.01.31
申请号 US201414465062 申请日期 2014.08.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Ko JeongWook;Kim Hongki;Park Younghoon;Park Wonje;Ahn Yu Jin;Lee Junetaeg
分类号 H01L27/146 主分类号 H01L27/146
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. An image sensor, comprising: a semiconductor layer having a light-receiving region and a light-blocking region, the semiconductor layer including photoelectric conversion devices; a light-blocking layer on a surface of the semiconductor layer and on the light-blocking region; color filters on the semiconductor layer and the light-blocking layer; and micro lenses on the color filters, the color filters being absent from an interface region, the interface region being between the light-receiving region and the light-blocking region.
地址 Gyeonggi-do KR