发明名称 |
Image sensor and method of fabricating the same |
摘要 |
Example embodiments disclose an image sensor and a fabricating method thereof. An image sensor may include a semiconductor layer with a light-receiving region and a light-blocking region, the semiconductor layer including photoelectric conversion devices, a light-blocking layer on a surface of the semiconductor layer, color filters on the semiconductor layer and the light-blocking layer, and micro lenses on the color filters. The color filters are absent from an interface region between the light-receiving region and the light-blocking region. |
申请公布号 |
US9559140(B2) |
申请公布日期 |
2017.01.31 |
申请号 |
US201414465062 |
申请日期 |
2014.08.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Ko JeongWook;Kim Hongki;Park Younghoon;Park Wonje;Ahn Yu Jin;Lee Junetaeg |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. An image sensor, comprising:
a semiconductor layer having a light-receiving region and a light-blocking region, the semiconductor layer including photoelectric conversion devices; a light-blocking layer on a surface of the semiconductor layer and on the light-blocking region; color filters on the semiconductor layer and the light-blocking layer; and micro lenses on the color filters, the color filters being absent from an interface region, the interface region being between the light-receiving region and the light-blocking region. |
地址 |
Gyeonggi-do KR |