Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

摘要

An apparatus includes a substrate having a land side having a plurality of contact pads and a die side opposite the land side. The apparatus includes a first die and a second die wherein the first die and second die are embedded within the substrate such that the second die is located between the first die and the land side of the substrate.

主权项

1. A method of forming a multi-chip package comprising:
attaching a first die to a carrier, wherein the first die is positioned in a cavity formed in the carrier; forming a first insulating layer over said first die and said carrier such that said first die is embedded within said first insulating layer; placing a second die above said first insulating layer; forming a second insulating layer over said second die so that said second die is embedded within said second insulating layer; and separating the carrier from the first insulating layer so that no portion of the carrier remains in contact with the first insulating layer.