Apparatuses and methods for die seal crack detection

摘要

Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.

主权项

1. A method for detecting a crack in a die having a die seal, the method comprising:
detecting an electrical signal at an end of a via chain, the via chain being arranged around a circumference of the die seal between a periphery of the die and the die seal, wherein a pad is arranged to be surrounded by the die seal and coupled to an end of the via chain, and wherein the die seal comprises a gap to route a lead for coupling the pad to the end of the via chain, the via chain including a plurality of contacts extending through portions of the die; and comparing the detected electrical signal to a criterion to determine whether a crack exists in the die.