| 发明名称 | MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging | ||
| 摘要 | A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed. | ||
| 申请公布号 | US9557237(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201414539044 | 申请日期 | 2014.11.12 |
| 申请人 | SENSATA TECHNOLOGIES, INC. | 发明人 | McNeal Mark P.;Strott Douglas B.;Greene Stephen P. |
| 分类号 | G01F1/80;G01L9/06;G01F1/44;G01F1/76;H01L41/25;G01L9/00;G01L19/06 | 主分类号 | G01F1/80 |
| 代理机构 | Adler Pollock & Sheehan P.C. | 代理人 | Adler Pollock & Sheehan P.C. ;Chaclas, Esq. George N.;Holmander, Esq. Daniel J. |
| 主权项 | 1. A pressure sensing element comprising a sensing sub-element disposed on a diaphragm, the element comprising: a field shield disposed over the sub-element, a contact via and an interconnect disposed between the sub-element and the contact via, and a field shield circuit configured to substantially eliminate influence of external charge on the sub-element during operation by applying a potential to a substrate of the diaphragm and the field shield. | ||
| 地址 | Attleboro MA US | ||