| 摘要 |
A method for determining an area of a region for receiving a heat sink on a surface of a chip-supporting substrate is disclosed. The method can include determining, in response to a specified voltage drop associated with substrate wiring, a first set of wiring cross-sectional areas and corresponding lengths that satisfy the specified voltage drop. The method can also include determining, by selecting, in response to a specified thermal resistance associated with substrate wiring and insulating layers, from the first set, a second set of wiring cross-sectional areas and corresponding lengths that satisfy the specified thermal resistance. The method can also include selecting, from a set of placement areas corresponding to the second set of wiring cross-sectional areas and corresponding lengths, a heat sink placement area that is greater than a lower size for a placement area and less than an upper size for a placement area. |
| 主权项 |
1. A method of selecting, on a rear face of a wiring portion of a chip-supporting substrate, a surface region for positioning of a heat sink thereon, the method comprising:
calculating, in accordance with a specified maximum voltage drop across an electrically conductive wire within the wiring portion of the chip-supporting substrate, a first set of wire lengths and a corresponding first set of wire cross-sectional areas; selecting, from the first set of wire lengths and from the first set of wire cross-sectional areas, in accordance with a specified maximum combined thermal resistance value of the electrically conductive wire and an electrically insulating layer within the wiring portion of the chip-supporting substrate, a first subset of wire lengths and a corresponding first subset of wire cross-sectional areas; selecting, from the first subset of wire lengths, a maximum wire length corresponding to the specified maximum voltage drop, the maximum wire length corresponding to a maximum surface region area; selecting, from the first subset of wire lengths, a minimum wire length, the minimum wire length corresponding to a minimum surface region area; and determining a surface region of the chip-supporting substrate for the positioning of the heat sink, the surface region having an area greater than the minimum surface region area and less than the maximum surface region area. |
