| 发明名称 | Package for optical module | ||
| 摘要 | A package for optical module includes a flat-plate-shaped metal base, and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to an upper surface of the metal base by soldering. The ceramic circuit board has a shape change portion in which the ceramic circuit board is changed in shape along the longitudinal direction, and a region of the ceramic circuit board not including the shape change portion is joined to the metal base by soldering. The shape change portion of the ceramic circuit board is a portion where a width is changed along the longitudinal direction, or a portion where a thickness is changed along the longitudinal direction. | ||
| 申请公布号 | US9560763(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201314410866 | 申请日期 | 2013.07.01 |
| 申请人 | Nippon Telegraph and Telephone Corporation;NTT Electronics corporation | 发明人 | Ogawa Ikuo;Kasahara Ryoichi;Nishizawa Toshiki;Mitsuhashi Yuji |
| 分类号 | H05K7/00;H05K1/18;H05K1/02;G02B6/42 | 主分类号 | H05K7/00 |
| 代理机构 | Workman Nydegger | 代理人 | Workman Nydegger |
| 主权项 | 1. A package for an optical module comprising: a metal base in a shape of a flat-plate; and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, the ceramic circuit board including a wiring pattern portion and a pad portion, wherein the ceramic circuit board includes a first portion in which the ceramic circuit board is changed in shape along the longitudinal direction, at least a portion of only the wiring pattern portion is joined to an upper surface of the metal base by soldering, and the first portion is not joined to the upper surface of the metal base by soldering. | ||
| 地址 | Tokyo JP | ||