发明名称 Thermoelectric power module
摘要 A thermoelectric power module capable of withstanding a long time use in a high temperature environment where a temperature (Th) of a higher temperature portion exceeds 250° C. The thermoelectric power module includes: a thermoelectric power element; a first diffusion prevention layer consisting of molybdenum (Mo) and disposed on a surface of the thermoelectric power element; a second diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni—Sn) and disposed on a surface of the first diffusion prevention layer opposite to the thermoelectric power element side; an electrode; a third diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni—Sn) and disposed on a surface of the electrode; a solder layer containing lead (Pb) at not less than 85% and configured to join the second diffusion prevention layer and the third diffusion prevention layer to each other.
申请公布号 US9559281(B2) 申请公布日期 2017.01.31
申请号 US201113579382 申请日期 2011.02.14
申请人 KOMATSU LTD. 发明人 Kajihara Takeshi;Ishida Kouichi;Fujimoto Shinichi;Mizukami Hiroyuki
分类号 H01L35/30;H01L35/28;H01L35/08;H01L35/00;H01L35/32 主分类号 H01L35/30
代理机构 Wenderoth, Lind & Ponack, L.L.P. 代理人 Wenderoth, Lind & Ponack, L.L.P.
主权项 1. A thermoelectric power module comprising: a thermoelectric power element; a first diffusion prevention layer consisting essentially of molybdenum (Mo) and disposed on a surface of said thermoelectric power element; a second diffusion prevention layer consisting essentially of an intermetallic compound of nickel-tin Ni—Sn selected from the group consisting of Ni3Sn having enthalpy of formation of −24.9 kJ/mol Ni3Sn having enthalpy of formation of −34.6 kJ/mol and Ni3Sn4 having enthalpy of formation of −24.0 kJ/mol when the intermetallic compound is produced from nickel, said second diffusion prevention layer being disposed on a surface of said first diffusion prevention layer opposite to said thermoelectric power element side; an electrode formed of copper (Cu); a third diffusion prevention layer consisting essentially of the intermetallic compound of nickel-tin (Ni—Sn) and disposed on a surface of said electrode so as to surround said electrode; and a solder layer containing lead (Pb) at not less than 85% and configured to join said second diffusion prevention layer and said third diffusion prevention layer to each other.
地址 Tokyo JP