Light emitting diode load board and manufacturing process thereof

摘要

A light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer and a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.

主权项

1. A light emitting diode (LED) load board, comprising:
a substrate; a first dielectric layer formed on the substrate; a second dielectric layer comprising:
a first structure portion formed on the first dielectric layer and comprising a first sidewall;a second structure portion formed on the first structure portion and comprising a second sidewall, which is more prominent than the first sidewall; anda third structure portion formed on the second structure portion and comprising N pieces of sidewall, wherein odd one of the N pieces of sidewall is more prominent than even one of the N pieces of sidewall, and the first and second sidewalls and the N pieces of sidewall constitute a first etched portion exposing a fraction of the first dielectric layer; a first conductive pad formed in the first etched portion; and a second conductive pad formed on the second dielectric layer, covering a fraction of the second dielectric layer, and exposing openings of the first etched portion.