发明名称 |
Display device and method for manufacturing the same |
摘要 |
A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer. |
申请公布号 |
US9559317(B2) |
申请公布日期 |
2017.01.31 |
申请号 |
US201615145260 |
申请日期 |
2016.05.03 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Yamazaki Shunpei;Ohno Masakatsu;Adachi Hiroki;Idojiri Satoru;Takeshima Koichi |
分类号 |
H01L21/00;H01L51/00;H01L51/56;H01L51/52;H01L29/24;H01L29/66;H01L29/786;B23K26/04;B23K26/06;B23K26/08;H01L27/12;H01L51/50;H01L41/314;H01L27/32 |
主分类号 |
H01L21/00 |
代理机构 |
Robinson Intellectual Property Law Office |
代理人 |
Robinson Intellectual Property Law Office ;Robinson Eric J. |
主权项 |
1. A processing apparatus for peeling an organic resin layer from a substrate, the processing apparatus comprising:
a laser oscillator configured to emit a laser light; an optical system configured to extend the laser light; a mirror configured to reflect the laser light; and a lens configured to condense the laser light into a linear beam, wherein the mirror is provided between the optical system and the lens, wherein a reflective surface of the mirror is inclined so that a traveling direction of the laser light is directed toward a first surface of the substrate, wherein the processing apparatus is configured to irradiate the organic resin layer with the linear beam, wherein the organic resin layer is formed on a second surface of the substrate, and wherein the linear beam enters the organic resin layer through the first surface and the second surface of the substrate. |
地址 |
Kanagawa-ken JP |