发明名称 Display device and method for manufacturing the same
摘要 A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
申请公布号 US9559317(B2) 申请公布日期 2017.01.31
申请号 US201615145260 申请日期 2016.05.03
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei;Ohno Masakatsu;Adachi Hiroki;Idojiri Satoru;Takeshima Koichi
分类号 H01L21/00;H01L51/00;H01L51/56;H01L51/52;H01L29/24;H01L29/66;H01L29/786;B23K26/04;B23K26/06;B23K26/08;H01L27/12;H01L51/50;H01L41/314;H01L27/32 主分类号 H01L21/00
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A processing apparatus for peeling an organic resin layer from a substrate, the processing apparatus comprising: a laser oscillator configured to emit a laser light; an optical system configured to extend the laser light; a mirror configured to reflect the laser light; and a lens configured to condense the laser light into a linear beam, wherein the mirror is provided between the optical system and the lens, wherein a reflective surface of the mirror is inclined so that a traveling direction of the laser light is directed toward a first surface of the substrate, wherein the processing apparatus is configured to irradiate the organic resin layer with the linear beam, wherein the organic resin layer is formed on a second surface of the substrate, and wherein the linear beam enters the organic resin layer through the first surface and the second surface of the substrate.
地址 Kanagawa-ken JP