Light-emitting package structure and method of fabricating the same

摘要

A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.

主权项

1. A light-emitting package structure, comprising:
an encapsulant having a first surface and a second surface opposing the first surface; at least one light-emitting component embedded in the encapsulant, the light-emitting component having a light-emitting side exposed from the first surface of the encapsulant and a non-emitting side opposing the light-emitting side and positioned at the same side with the second surface of the encapsulant, the non-emitting side having a plurality of electrodes; at least one dam embedded in the encapsulant and exposed from the first surface of the encapsulant, wherein the light-emitting side of the light-emitting component is flush with a side of the dam; and a phosphor layer formed on the first surface of the encapsulant, being in contact with the dam, and covering the light-emitting side of the light-emitting component.