Semiconductor device

摘要

A semiconductor device includes a laminated substrate having circuit boards, an insulating plate, and a metal plate laminated, and warped convexly to the circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate having a predetermined disposition region in which the laminated substrate is disposed, grooves disposed in the outer periphery of the disposition region, and projections disposed in positions in the disposition region adjacent to and inside the grooves. The grooves has on the projection side an inclination corresponding to an inclination caused by the warp of the laminated substrate. A joining material fills the space between the metal plate and the disposition region and covers the grooves and projections.

主权项

1. A semiconductor device comprising:
a laminated substrate including circuit boards, an insulating plate, and a metal plate laminated together, and warped convexly to a circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate including a predetermined disposition region on which the laminated substrate is disposed, grooves disposed outside the disposition region, and projections disposed in the disposition region adjacent to and inside the grooves, the grooves having on a projection side an inclination corresponding to an inclination caused by a warp of the laminated substrate; and a joining material which fills a space between the metal plate and the disposition region and which fills the grooves.