Electronic component and method of manufacturing the same

摘要

An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.

主权项

1. An electronic component comprising:
a circuit board having a main surface; a chip component having a sensor part disposed so as to face the main surface; a plurality of bump electrodes disposed between the main surface and the chip component so as to be placed inside of an edge of the chip component in a plan view of the main surface; a dam member provided between the main surface and the chip component so as to extend at least from the edge of the chip component to outer positions of the plurality of bump electrodes in a plan view of the main surface; and an under-fill material provided at least in a clearance between the dam member and the chip component; wherein a space is formed in a region enclosed by the plurality of bump electrodes in a plan view of the main surface, the space being between the main surface and the sensor part, and the under-fill material is disposed outside of the space in a plan view of the main surface.