Semiconductor package having a multi-layered base

摘要

A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the semiconductor die at a top surface of the conductive base, where the conductive base includes a first layer having a first coefficient of thermal expansion (CTE), and a second layer having at least one mounting tab and a second CTE. The conductive base is configured to reduce thermal stress in the ceramic case, where the first CTE is equal to or slightly different than a CTE of the ceramic case, the second CTE is greater than the first CTE, and a CTE of the PCB is greater than or equal to the second CTE. The conductive base is configured to electrically couple a power electrode of the semiconductor die to the PCB.

主权项

1. A semiconductor package for mounting to a printed circuit board (PCB), said semiconductor package comprising:
a semiconductor die in a ceramic case; a conductive base coupled to said semiconductor die at a top surface of said conductive base; and wherein said conductive base comprises a first layer having a first coefficient of thermal expansion (CTE), and a second layer, wherein the second layer comprises a first mounting tab overlapping a first corner of the first layer and a second mounting tab overlapping a second corner of the first layer, wherein the first mounting tab and the second mounting tab have a second CTE, wherein said first CTE is similar to a CTE of the ceramic case, and wherein said second CTE is greater than said first CTE.